WIN Semiconductors Welcomes SawStreet LLC to the WIN ALLIANCE Partner Program

Orlando-based backend specialist gives WIN customers an additional U.S. source for wafer grinding, thinning, dicing, pick-and-place and die inspection

WIN Semiconductors Corp. (TPEx:TPEx: 3105)

TAOYUAN, TAIWAN, October 5, 2026 /EINPresswire.com/ -- WIN Semiconductors Corp (TPEx: 3105), the world's largest pure-play compound semiconductor foundry, today announced the addition of Orlando, Florida-based SawStreet LLC to the WIN Alliance Partner Program. The partnership complements WIN's in-house backend processes, giving customers another trusted partner for wafer grinding and thinning, dicing, pick-and-place and die inspection.

SawStreet handles thicknesses as low as 50 µm, and specializes in wafer grinding and thinning, including dice-before-grind (DBG), along with precision dicing, high-speed pick & place, and visual die inspection to MIL-STD-883 Condition A or B, or to customer internal specifications.

“We are pleased to be invited into the WIN Alliance,” said Jim Young, President and CEO of SawStreet LLC. “SawStreet has spent years handling GaAs, GaN and InP wafers for demanding commercial, defense and space programs, and we understand how much value sits on a single wafer by the time it leaves a fab like WIN's. Joining the Alliance gives WIN customers a U.S.-based partner for backend processing, with the quick-turn schedules and handling discipline those programs require.”

Russ Wagner, Vice President of Business Development for WIN Semiconductors, commented, “Adding SawStreet to the WIN Alliance gives our customers an alternate backend processing option that complements the services WIN already provides. Their expertise adds another layer of support for customers looking to reduce overall wafer processing cycle time.”

About SawStreet LLC
SawStreet is a privately owned, quick-turn semiconductor backend service provider based in Orlando, Florida. The company offers grinding, dicing, pick-and-place and inspection services engineered for the demanding requirements of defense, aerospace and RF applications, and handles a wide range of substrates including GaAs, InP, SiGe, GaN/SiC, fused silica and sapphire.

About WIN Semiconductors Corp.
WIN Semiconductors Corp. is the leading global provider of pure-play GaAs and GaN wafer foundry services for the wireless, infrastructure and networking markets. WIN provides its foundry partners a diverse portfolio of Heterojunction Bipolar Transistor (HBT), Pseudomorphic High Electron Mobility Transistor (pHEMT), Gallium Nitride High Electron Mobility Transistor (GaN HEMT), PIN diode and optical device technology solutions that support leading-edge products for applications from 50 MHz to 170 GHz and through light-wave. Custom products built by WIN Semiconductors Corp. are found in a vast array of markets, including smartphone, mobile infrastructure, 3D sensing, optical communications, CATV, aerospace, defense, satellite and automotive applications.

For more than 25 years, WIN has provided foundry services from its state-of-the-art, ISO 9001/14001-certified 150 mm GaAs facility headquartered in Taoyuan City, Taiwan. WIN provides customers with a diverse array of device technology platforms and value-added services, including DC/RF product testing, Cu wafer bumping and advanced packaging solutions for accelerated product development. For more information, visit www.winfoundry.com.

Kara Harmon
WIN Semiconductors Corp.
kharmon@use.winfoundry.com